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  LH2042-PF doc. no : qw0905- rev. : date : 30 - oct. - 2008 a data sheet LH2042-PF round type led lamps ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. ligitek electronics co.,ltd. property of ligitek only directivity radiation package dimensions part no. LH2042-PF page 1/5 25% 75% 100% 0 25% 50% -60 100% 75% 50% 60 0 -30 30 3.0 4.0 5.2 1.5max 4.2 2.54typ 0.5 typ 1.0min 25.0min + -
-40 ~ +100 tstg storage temperature forward voltage @20ma(v) luminous intensity @10ma(mcd) spectral halfwidth nm viewing angle 2 1/2 (deg) material peak wave length pnm part no note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. gap LH2042-PF4.5 typ. 697 red white diffused 3.0 2.6 1.7 90 emittedlensmin.max.min. 36 typical electrical & optical characteristics (ta=25 ) color page 2/5 part no. reverse current @5v operating temperature peak forward current duty 1/10@10khz absolute maximum ratings at ta=25 forward current power dissipation parameter 20 ma i f t opr ir -40 ~ +85 10 pd i fp 50 60 a ma mw symbol h ratings unit ligitek electronics co.,ltd. property of ligitek only LH2042-PF
1.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) 1000 900 800 700 600 wavelength (nm) fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a 0.0 0.5 1.0 0.8 -40 0.9 -20020406080100-40 0.0 1.0 0.5 -20 80 40 20 060100 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current forward current(ma) fig.4 relative intensity vs. temperature forward voltage(v) fig.3 forward voltage vs. temperature 1.1 1.0 1.2 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 100 10 1000 2.03.0 2.0 3.0 2.5 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 4.05.01.0 0.0 0.5 1.0 2.0 1.5 3.0 2.5 typical electro-optical characteristics curve fig.1 forward current vs. forward voltage h chip part no. 101001000 page3/5 LH2042-PF
ligitek electronics co.,ltd. property of ligitek only page 4/5 time(sec) 150 100 2.wave soldering profile temp( c) 120 260 2 /sec max 50 0 25 0 60 seconds max preheat note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) part no. LH2042-PF
ligitek electronics co.,ltd. property of ligitek only page 5/5 reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 description test condition 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature storage test operating life test reliability test: test item 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec solder resistance test solderability test thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. part no. LH2042-PF


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